Nuvoton Technology Corporation America

Compensation

Full Description

About the Role We are seeking an experienced R&D leader to manage and grow a large, multi-disciplinary engineering organization across Taiwan and the USA. This role requires significant time on-site in Taiwan. This team includes experts in analog, digital, systems, firmware, and software. Your primary focus will be on building and strengthening leadership capabilities, driving team performance, and ensuring seamless collaboration across regions. In addition to leading the organization, you will oversee the full IC development lifecycle—from definition and design through tape‑out, bring‑up, testing, and qualification—while fostering a culture of innovation and operational excellence. A key part of your role will be to implement modern EDA methodologies and AI-driven productivity tools to enhance efficiency and quality across programs. RESPONSIBILITY • Lead & scale a 100+ multi‑disciplinary engineering team across Taiwan and the USA (analog, digital, systems, firmware, software). • Direct the end‑to‑end IC development lifecycle (architecture/spec → design → verification → tape‑out → bring‑up → test → qualification → ramp). • Build high‑performing teams: recruit, mentor, and develop senior engineers and managers; strengthen succession and leadership pipelines. • Modernize design methodologies and automation workflows, accelerating adoption of scalable, AI enabled engineering practices. • Champion AI/ML integration across HW/SW to enhance design exploration, verification quality, test/yield analytics, and engineering velocity. • Advance AI application development and strengthen ecosystem partnerships with cloud/edge AI platforms, algorithm teams, and software solution providers. • Align cross‑functionally with Product Marketing, Operations, Quality, Foundry/OSAT, and Global R&D on technology and resourcing priorities. • Manage resources & partnerships: budgeting, headcount planning, and vendor/partner relationships to maximize velocity and ROI. QUALIFICATIONS • Ph.D. in EE/CS or related fields; bilingual in English and Mandarin. • 15+ years of semiconductor/IC development, including MCU/MPU design, chip architecture, AI system architecture, and machine learning/AI applications. • 8+ years leading large engineering organizations with senior level technical and managerial oversight. • Demonstrated experience implementing AI/ML to enhance engineering workflows. • Proven success driving complex programs from concept through tape out, bring up, qualification, and production. • Strong command of EDA tools and modern development methodologies. Preferred Background (Highly Valued) • Strong connections and influence within the AI ecosystem. • RISC‑V and multi‑core MCU/MPU development. • Hardware‑software integration for AI accelerators. • Experience with LLM training and inference. • Chiplet architecture and implementation.