Micron Technology

Compensation

Full Description

Lead DRAM technology transfer projects for assigned wet‑process areas, handling schedules, metrics, achievements, and alignment with sending‑fab expectations. Collaborate closely with sending‑fab counterparts, MCT, PE, PIE, ME, Planning, and SPMO to close qualification, startup, yield, and ramp gaps. Develop and maintain project plans, communication plans, Transfer Expectations (tool selection, VMP matching, wafer needs, SWAP plans), and alignment strategies. Support tool evaluations, value engineering projects, GCP matching, and qualification setup—including traveler creation, PRD/TRD data collection, and mismatch resolution through CEERB. Coordinate FOAK/SOAK material readiness and quality matching, ensuring timely approvals, data reviews, and punch‑list item closure. Monitor lead‑lot health, respond to abnormal process signals, and support MSSR matching and execution of SWAP, EFF, Qual, and derivative startup lots. Gather lessons learned, drive improvements for future transfers, participate in team meetings, and ensure NPI/MSR timelines and documentation are completed effectively. Technical Competency: Ability to complete structured engineering tasks, analyze process and matching data, and support technology transfer activities. Collaboration: Strong communication skills with the ability to work multi-functionally across engineering, manufacturing, and global partner sites. Execution: Demonstrated ability to handle timelines, track achievements, and complete engineering tasks with accuracy and ownership. Domain Expertise: Wet‑process engineering experience and familiarity with DRAM technology transfer. Technical Leadership: Experience supporting PRD/TRD data analysis, CEERB processes, tool matching, or advanced technology node ramp. Cross‑Site Collaboration: Prior experience working with sister sites, transfer teams, or multi‑fab alignment programs.