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LR

Lam Research

via Eightfold

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Process Engineer 2

Tualatin, Oregon
Full-time
Posted 11/22/2025
Direct Apply
Key Skills:
Statistical Process Control (SPC)
Design of Experiments (DOE)
MATLAB
Python
Statistical analysis
Atomic Layer Deposition (ALD)
Chemical Vapor Deposition (CVD)
Plasma Physics
Reactive Ion Etching (RIE)
Material synthesis
Material characterization

Compensation

Salary Range

$60K - 90K a year

Responsibilities

Conduct process engineering research and development to improve semiconductor manufacturing processes and product yields.

Requirements

Entry-level graduate with a Master's or PhD in relevant fields, familiarity with semiconductor lab equipment, statistical tools, and deposition/etching techniques.

Full Description

Conduct process engineering research, development, and evaluation in support of Lam's cutting-edge semiconductor equipment and systems. Review and enhance processing techniques and methods applied in the manufacture and fabrication of products. Develop and sustain new processes and process improvements to reduce production costs and increase yields. Compile and analyze test data to establish next steps in process development and determine appropriate limits and variables for process specifications. Collaborate internally to plan, collect data, analyze results, and report on customer demos for existing process applications. Master's degree or PhD in Materials Science, Chemical Engineering, Chemistry or Physics or related field with no previous professional experience; or equivalent experience. This is a graduate eligible role. Familiarity with working in a laboratory and on semiconductor equipment with experience in surface preparation and analytical techniques. In-depth understanding of Statistical Process Control (SPC) and/or Design of Experiments (DOE). Proficient in MATLAB, Python, or other similar scientific computing language. Working knowledge of statistical analysis and problem-solving methodologies. Experience with statistical tools (JMP, Minitab, etc.) Background in Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), or Physical Vapor Deposition (PVD). Background in Plasma Physics, Reactive Ion Etching (RIE), Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP). Knowledge of Material synthesis and material characterization.

This job posting was last updated on 11/28/2025

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