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I

100 Intel Corporation

via Indeed

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High-Speed I/O PHY Architect

Folsom, CA
Full-time
Posted 12/1/2025
Verified Source
Key Skills:
High-Speed I/O PHY Architecture
PCIe, CXL, USBx, Display, MIPI, Ethernet, TSN protocols
IP Evaluation and Vendor Engagement
Technical Documentation
Post-Silicon Debug and Validation
Technical Leadership and Mentorship

Compensation

Salary Range

$215K - 350K a year

Responsibilities

Lead architectural definition and integration of high-speed PHYs for client SoCs, evaluate IPs, research emerging technologies, provide technical mentorship, and lead post-silicon validation.

Requirements

BS in Electrical/Computer Engineering with 15+ years experience or MS/PhD with 12+ years, hands-on HSIO PHY architecture experience, strong leadership and communication skills.

Full Description

Job Details: Job Description: Join Our Team as a High-Speed I/O PHY Architect. Are you a visionary in High-Speed I/O PHY Architecture? Do you have a passion for driving innovation and shaping the future of cutting-edge PHYs for next-generation client SoCs? If so, we want you to be a part of our Client CIT team. In this pivotal role, you will be instrumental in defining the architecture, performance, and power efficiency of our high-speed interfaces, directly impacting the success of our client products.Collaborate closely with a diverse range of cross-functional teams to ensure seamless integration and optimized system-level performance. This is a high-impact role offering the opportunity to drive innovation and influence the future of our client SoC technology. Key Responsibilities Architectural Leadership: Lead the architectural definition and integration of high-speed PHYs for client SoCs, including PCIe, CXL, USBx (e.g., eUSB2, USB3, USB4), Display, MIPI (D-PHY, C-PHY, M-PHY), Ethernet, and TSN. Collaborate with platform and product architects to analyze requirements and define critical performance, power, and area specifications to ensure the success of our products. IP Evaluation: Conduct technical evaluations of both internal and external PHY IPs, analyzing their performance characteristics against product requirements, and ensuring strategic alignment with overall product goals. Define detailed IP requirements, lead vendor engagement, and make strategic IP selection recommendations based on technical feasibility, cost-effectiveness, and long-term roadmap alignment. Technology Vision: Proactively research and evaluate emerging high-speed I/O technologies, industry trends, and evolving standards. Identify and champion opportunities to incorporate these advancements into our product roadmap, enhancing performance, power efficiency, and feature sets, and positioning our products for competitive advantage. Technical Documentation: Create clear and comprehensive architecture specifications and rigorous integration guidelines. Provide review and constructive feedback on related architectural specifications to ensure alignment with overall SoC goals. Technical Mentorship and Collaboration: Provide technical guidance and mentoring to junior engineers, fostering their growth and contributing to the overall team expertise. Champion a collaborative environment across multiple teams. Post-Silicon Leadership: Serve as a technical lead in the post-silicon debug and validation of high-speed I/O interfaces, leading taskforces and driving the resolution of complex issues. Oversee the validation process to ensure seamless and high-quality implementations. Additional Skills: Demonstrated strategic acumen with proven effectiveness in collaborating with senior technologists and business leaders across organizational boundaries.• Demonstrated ability to network with and influence a broad range of stakeholders Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.Minimum Qualifications:• BS degree in Electrical/Computer Engineering with a minimum of 15 years of experience. Master's or PhD degree in Electrical/Computer Engineering with minimum 12 years of experience Preferred Qualifications: High familiarity with industry trends within the HSIO domain and the ability to map them to Intel roadmap/products and segment strategies. We look forward to welcoming a dynamic and innovative High-Speed I/O (PHY) Architect to our team. Apply now and be a part of shaping the future of our client SoC technology. Prior hands-on experience in High-Speed IO PHY Architecture and Design. Strong knowledge in the interoperability of HSIO PHYs within the PCIe, SATA, Ethernet, USB2, USB3, USB4, Display or MIPI IO Controller subsystems Strong technical leadership and communication skills Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, California, Folsom Additional Locations: US, Arizona, Phoenix, US, California, Santa Clara, US, Oregon, Hillsboro Business group: The Silicon Engineering Group (SIG) is a worldwide organization focused on the development and integration of SOCs, Cores, and critical IPs from architecture to manufacturing readiness that power Intel’s leadership products. This business group leverages an incomparable mix of experts with different backgrounds, cultures, perspectives, and experiences to unleash the most innovative, amazing, and exciting computing experiences. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter. Benefits: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003 Annual Salary Range for jobs which could be performed in the US: 214,730.00 USD - 349,850.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. Intel’s official careers website. Find your next job and take on projects that shape tomorrow’s technology. Benefits Internships Life at Intel Locations Recruitment Process Discover your place in our world-changing work.

This job posting was last updated on 12/4/2025

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